Circuit board structure for high frequency signals
AssigneeKinsus Interconnect Technology Corp.
InventorsJun-Chung Hsu, Yu-Hui Wu
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AssigneeKinsus Interconnect Technology Corp.
InventorsJun-Chung Hsu, Yu-Hui Wu
Estimating the term…
A circuit board structure for high frequency signals includes a substrate and an electrical conductive circuit layer formed on the substrate. The conductive circuit layer includes circuit patterns and connection pads. The circuit pattern includes a base part with a shape of a rectangular block and a circular top part with a hemispherical shape provided on the base part. The circular top part can be modified by a circular bottom part embedded in the dielectric plastic film. Alternatively, a double layer structure with the circular top and bottom parts is formed such that the surface of the circuit pattern is provided with hemispheres to strengthen the reflection, thereby overcoming the problem of signal concentration due to the rectangular structure or the issue of signal attenuation due to surface roughness.
A circuit board structure for high frequency signals, comprising:
A circuit board structure for high frequency signals, comprising:
A circuit board structure for high frequency signals, comprising:
Dependencies are inferred from the claim text.