Mechanisms for cleaning wafer and scrubber
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTai-Liang LYU, Shao-Yen KU, Tzu-Yang CHUNG, Chia-Ming TAI, Chao-Hui KUO
Life of this patent
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Abstract
Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.
Claims20
A method for cleaning a wafer, comprising:
- cleaning a wafer by using a wafer scrubber;
- cleaning the wafer scrubber in a scrubber cleaning module, wherein an agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber;
- and
- cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.
A method for cleaning a wafer, comprising:
- cleaning a portion of a wafer by using a wafer scrubber;
- cleaning the wafer scrubber in a scrubber cleaning module, wherein an agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber;
- and
- cleaning a remaining portion of the wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.
A system for cleaning a wafer, comprising:
- a wafer cleaning module configured to clean a wafer;
- and
- a scrubber cleaning module configured to clean a wafer scrubber used for cleaning the wafer, wherein the scrubber cleaning module comprises:
- a cleaning liquid supply, wherein the cleaning liquid supply is configured to provide a cleaning liquid on the wafer scrubber;
- and
- an agitation generator, wherein the agitation generator is configured to agitate the cleaning liquid.
Dependencies are inferred from the claim text.