Back to results
US 2015/0021290 A1Published application
Method for fabricating acoustic wave device
AssigneeTaiyo Yuden Co., Ltd.
InventorKeiji TSUDA
Life of this patent
Estimating the term…
Abstract
An acoustic wave device includes a piezoelectric substrate, interdigitated electrodes formed on the piezoelectric substrate, and an insulation film that is formed on a surface of the interdigitated electrodes by atomic layer deposition and includes aluminum oxide.
Claims14
A method for fabricating an acoustic wave device comprising:
- forming interdigitated electrodes on a piezoelectric substrate;
- and
- forming an insulation film including aluminum oxide on a surface of the interdigitated electrodes by atomic layer deposition.
Dependencies are inferred from the claim text.