Stress measurement sensor
AssigneesPro-Micron GmbH, Horst Siedle GmbH & Co. KG
InventorsChristian Helbig, Sebastian Lotz
Life of this patent
Estimating the term…
Abstract
A stress measurement sensor provided with a sensor element that operates according to the SAW principle, comprising a base composed of a first material and the sensor element, which is fixed to the base with a joining material, is to be developed such that it can also be used at higher temperatures and has improved measurement properties. In addition, it is suggested that the joining material be a glass solder.
Claims16
A stress measurement sensor provided with a sensor element that operates according to the SAW principle, comprising a base composed of a first material, and the sensor element, which is fixed to the base with a joining material, wherein the joining material is a glass solder.
A method for forming a stress measurement sensor having a sensor element that operates according to the SAW principle, which method comprises the following steps:
- a. provision of a base composed of a base material;
- b. provision of a sensor element operating according to the SAW principle, and having a carrier crystal;
- c. provision of a glass solder;
- d. connecting the base to the carrier crystal by means of interlayering, fusing and subsequent solidifying of the glass solder.
Dependencies are inferred from the claim text.