Integration of electronic chips onto a photonic chip
AssigneeAcacia Communications, Inc.
InventorLong CHEN
Life of this patent
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Abstract
Methods, structures, apparatus, devices, and materials to facilitate the integration of electronic integrated circuits (chips) including drivers, amplifiers, microcontrollers, etc., onto/into photonic integrated circuits (chips) using recessed windows exhibiting controlled depths onto/into the photonic chip. The electronic chips are positioned into the recessed windows and electrical connections between the electronic chips and the photonic chip are achieved by flip-chip techniques with predefined traces at a bottom of the recessed windows or direct wire bonding. Advantageously, this integration may be performed on a wafer level for large-volume productions.
Claims4
A method of integrating an electronic chip onto a photonic chip comprising the steps of:
- fabricating a window into the surface of the photonic chip, said window exhibiting a size and a thickness matching the electronic chip;
- positioning the electronic chip into the window such that the top surface of the electronic chip is substantially coplanar with the top surface of the photonic chip;
- and
- electrically connecting and mechanically securing the electronic chip to the photonic chip.
Dependencies are inferred from the claim text.