Neural sensing device and method for making the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorKuo-Hua Chen
Life of this patent
Estimating the term…
Abstract
The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion and a plurality of microprobes. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The conductive vias are disposed in the microprobes and electrically connected to the integrated circuit portion.
Claims20
A neural sensing device, comprising:
- a base having an active surface and a backside surface;
- an integrated circuit portion disposed on the active surface of the base;
- and
- a plurality of microprobes protruding from the backside surface of the base, each of the microprobes having a conductive via disposed therein and electrically connected to the integrated circuit portion.
A neural sensing device, comprising:
- a base having an active surface and a backside surface;
- an integrated circuit portion disposed on the active surface of the base;
- and
- a plurality of microprobes, wherein each of the microprobes has a probe body, an isolation layer and a conductive via, wherein the probe body protrudes from the backside surface of the base, the conductive via is disposed in the probe body, and the isolation layer covers the probe body and has an opening to expose a plated tip of the conductive via.
A method for making a neural sensing device, comprising:
- (a) providing a wafer having a base and an integrated circuit portion disposed on an active surface of the base;
- (b) forming a plurality of conductive vias in the base from the active surface of the base, wherein the conductive vias are electrically connected to the integrated circuit portion;
- (c) thinning the base from a backside surface thereof to expose the conductive via;
- (d) selectively removing the base from a backside surface thereof to form a plurality of probe bodies, wherein each of the conductive vias is disposed in each of the probes;
- and
- (e) dicing the wafer to form a plurality of neural sensing devices.
Dependencies are inferred from the claim text.