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US 2014/0273513 A1Published application
Resist composition and manufacturing method of semiconductor device
AssigneeSony Corporation
InventorsIsao Mita, Nobuyuki Matsuzawa, Koji Arimitsu
Life of this patent
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Abstract
There is provided a resist composition including a crosslinking material configured to cause crosslinking in the presence of an acid, an inclusion compound, and a solvent.
Claims6
A resist composition comprising:
- a crosslinking material configured to cause crosslinking in the presence of an acid;
- an inclusion compound;
- and
- a solvent.
1 more element
A method for manufacturing a semiconductor device, the method comprising:
- forming, on a semiconductor substrate, a first resist pattern configured to be able to supply an acid using a first resist composition;
- forming a second resist layer on the first resist pattern by coating with a second resist composition containing a crosslinking material configured to cause crosslinking in the presence of an acid, an inclusion compound, and a solvent;
- forming a crosslinked layer in the second resist layer by diffusing the acid from the first resist pattern into the second resist layer;
- and
- removing a non-crosslinked portion of the second resist layer.
2 more elements
Dependencies are inferred from the claim text.