Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
AssigneeHitachi Kokusai Electric Inc.
InventorsYoshiro HIROSE, Ryuji YAMAMOTO, Atsushi SANO
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AssigneeHitachi Kokusai Electric Inc.
InventorsYoshiro HIROSE, Ryuji YAMAMOTO, Atsushi SANO
Estimating the term…
A method of manufacturing a semiconductor device is disclosed. The method includes forming a thin film having a borazine ring skeleton and containing a predetermined element, boron, carbon, and nitrogen on a substrate by performing a cycle a predetermined number of times. The cycle includes supplying a precursor gas containing the predetermined element and a halogen element to the substrate; supplying a reaction gas including an organic borazine compound to the substrate; and supplying a carbon-containing gas to the substrate. In addition, the cycle is performed under a condition in which the borazine ring skeleton in the organic borazine compound is maintained.
A method of manufacturing a semiconductor device, the method comprising forming a thin film having a borazine ring skeleton and containing a predetermined element, boron, carbon, and nitrogen on a substrate by performing a cycle a first predetermined number of times, the cycle comprising:
A substrate processing apparatus, comprising:
A non-transitory computer-readable recording medium storing a program that causes a computer to perform a process of forming a thin film having a borazine ring skeleton and containing a predetermined element, boron, carbon, and nitrogen on a substrate by performing a cycle a predetermined number of times, the cycle comprising:
Dependencies are inferred from the claim text.