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US 2014/0273504 A1Published application
Selective deposition by light exposure
AssigneeApplied Materials, Inc.
InventorsAneesh Nainani, Joseph Johnson, Er-Xuan Ping, Adam Brand, Mathew Abraham
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Abstract
A substrate processing chamber comprising a chamber wall enclosing a process zone having an exhaust port, a substrate support to support a substrate in the process zone, a gas distributor for providing a deposition gas to the process zone, a solid state light source capable of irradiating substantially the entire surface of the substrate with light, and a gas energizer for energizing the deposition gas.
Claims21
A substrate processing chamber comprising:
- (a) a chamber wall enclosing a process zone having an exhaust port;
- (b) a substrate support to support a substrate in the process zone;
- (c) a gas distributor for providing a deposition gas to the process zone;
- (d) a solid state light source capable of irradiating substantially the entire surface of the substrate with light;
- and
- (e) a gas energizer for energizing the deposition gas.
3 more elements
A substrate fabrication process comprising:
- (a) placing a substrate in a process zone, the substrate comprising first exposed surfaces comprising at least one first material having a first bandgap energy level;
- (b) irradiating the substrate with light having a wavelength selected in relation to the first bandgap energy level of the first material;
- and
- (c) depositing material on the first exposed surfaces by providing an energized deposition gas in the process zone.
1 more element
A substrate processing method comprising:
- (a) placing a substrate in a process zone, the substrate comprising an array of first exposed surfaces composed of a first material having a first bandgap energy level, and an array of second exposed surfaces that at least partially surround the first exposed surfaces, the second exposed surfaces comprising a second material composed having a second bandgap energy level;
- (b) providing a deposition gas in the process zone;
- (c) irradiating the substrate with light that is selected to have a wavelength with a corresponding energy level that is higher than the first bandgap energy level and smaller than the second bandgap energy level;
- (d) selectively depositing material at a higher deposition rate on the first exposed surfaces relative to the deposition of the material on the second exposed surfaces by providing an energized deposition gas in the process zone;
- and
- (e) exhausting spent deposition gas from the process zone.
3 more elements
Dependencies are inferred from the claim text.