Wet Cleaning Method for Cleaning Small Pitch Features
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Hua Huang, Tsung-Min Huang, Chung-Ju Lee
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Abstract
A method for reducing contaminants in a semiconductor device is provided. The method includes cleaning the semiconductor substrate. The cleaning includes rotating the semiconductor substrate and dispersing an aerosol at a predetermined temperature to a surface of the semiconductor substrate or a layer formed on the substrate to be cleaned. The aerosol includes a chemical having a predetermined pressure and a gas having a predetermined flow rate.
Claims20
A method of cleaning a semiconductor substrate, comprising:
- providing a semiconductor substrate;
- rotating the semiconductor substrate;
- and
- dispersing an aerosol at a predetermined temperature to a surface of the semiconductor substrate to be cleaned, the aerosol comprising:
- a chemical agent having a predetermined pressure;
- and
- a gas agent having a predetermined flow rate.
A method for reducing contaminants in a semiconductor device, comprising:
- providing a semiconductor substrate;
- and
- cleaning the semiconductor substrate, wherein the cleaning comprises:
- rotating the semiconductor substrate;
- and
- dispersing an aerosol at a predetermined temperature to a surface of the semiconductor substrate or to a layer formed on the semiconductor substrate to be cleaned, the aerosol comprising:
- a chemical agent having a predetermined pressure;
- and
- a gas agent having a predetermined flow rate.
A wafer cleaning system configured to perform a wet cleaning process on a semiconductor wafer, comprising:
- a cleaning chamber;
- rotating means for rotating the semiconductor wafer;
- an aerosol comprising a chemical agent and a gas agent;
- dispersing means for dispersing the chemical agent and the gas agent into the cleaning chamber at a surface of the semiconductor wafer or a layer formed on the wafer to be cleaned;
- and
- controlling means for controlling the flow rate of the chemical agent and the gas agent into the cleaning chamber.
Dependencies are inferred from the claim text.