Method of encapsulating a micro-device by anodic bonding

Abstract

A method for encapsulating at least one micro-device, comprising at least the following steps: bonding a face of a first substrate comprising at least one material impermeable to noble gases, in contact with a second substrate comprising glass and with a thickness of about 300 μm or more; etching at least one cavity through the second substrate such that side walls of the cavity are at least partly formed by remaining portions of the second substrate and that an upper wall of the cavity is formed by part of said face of the first substrate; anodic bonding of the remaining portions of the second substrate in contact with a third substrate in which the micro-device is formed, such that the micro-device is encapsulated in the cavity.

Dependencies are inferred from the claim text.