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US 2014/0235065 A1Published application
Method of manufacturing semiconductor device and semiconductor manufacturing apparatus
AssigneeTokyo Electron Limited
InventorsHidetami YAEGASHI, Kenichi OYAMA, Masatoshi YAMATO
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Abstract
Disclosed is a semiconductor device manufacturing method that manufactures a semiconductor device having a resist pattern which is excellent in roughness property and line width property. The method includes forming a film which is elastic and incompatible with a resist patterned on an object to be processed to cover the surface of the resist, and heating the object to be processed formed with the film.
Claims10
A semiconductor device manufacturing method comprising:
- forming a film that is elastic and incompatible with a resist to cover a surface of the resist patterned on an object to be processed, and
- heating the object to be processed that is formed with the film.
A semiconductor manufacturing apparatus comprising:
- a resist pattern forming module which includes a resist liquid coating unit, an exposure unit and a developing unit, the resist pattern forming module being configured to form a resist pattern on an object to be processed,
- a film forming module configured to form a film that is elastic and incompatible with the resist pattern to cover the resist pattern, and
- a heating module configured to heat the object to be processed formed with the film.
Dependencies are inferred from the claim text.