Hot-wire method for depositing semiconductor material on a substrate and device for performing the method
AssigneeForschungszentrum Juelich GmbH
InventorsFriedhelm Finger, Andreas Schmalen, Johannes Wolff
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AssigneeForschungszentrum Juelich GmbH
InventorsFriedhelm Finger, Andreas Schmalen, Johannes Wolff
Estimating the term…
A hot wire device and method for depositing semiconductor material onto a substrate in a deposition chamber in which the ends of at least two filaments are clamped into a filament holder and heated by supplying current, wherein a voltage for generating an electrical current is applied in temporal succession to filaments made of differing materials so that a number of differing semiconductors corresponding to the number of consecutively heated filament materials can be consecutively deposited onto the substrate without opening the chamber.
A hot wire method for depositing semiconductor material onto a substrate in a deposition chamber, comprising clamping the ends of at least two filaments into a filament holder, heating the filaments by supplying current, applying a voltage for generating an electrical current in temporal succession to filaments made of differing materials so that a number of differing semiconductors corresponding to the number of consecutively heated filaments materials can be consecutively deposited onto the substrate without opening the chamber.
Dependencies are inferred from the claim text.