Semiconductor device and electronic apparatus
AssigneeSeiko Epson Corporation
InventorsToshiyuki KASAI, Takeshi KOSHIHARA
Life of this patent
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Abstract
A semiconductor device that is connected to a wiring substrate includes a semiconductor substrate, a circuit provided on the semiconductor substrate, a connection terminal, and a guard ring that is provided on a peripheral region. In the semiconductor device, the guard ring includes a plurality of wiring layers, and a wiring layer included in the guard ring, which is the farthest from the semiconductor substrate, corresponds to a wiring layer closer to the semiconductor substrate relative to a wiring layer of the connection terminal.
Claims20
A semiconductor device that is connected to a wiring substrate comprising:
- a semiconductor substrate having an outer edge;
- a circuit provided on a circuit formation region of the semiconductor substrate;
- a connection terminal that is connected to a conductive pattern included in the wiring substrate and is provided on the circuit formation region;
- and
- a guard ring that includes a plurality of wiring layers and is provided on a peripheral region which is a region between the circuit formation region and the outer edge,
- wherein the guard ring is provided on a connection region, which overlaps with the wiring substrate, and
- in the connection region, a first wiring layer of the guard ring, which is the farthest from the semiconductor substrate, corresponds to a wiring layer closer to the semiconductor substrate relative to a second wiring layer of the connection terminal.
A semiconductor device that is connected to a wiring substrate comprising:
- a substrate having an outer edge;
- a circuit provided on a circuit formation region of the substrate;
- a power supply unit for supplying a predetermined potential and is provided on the circuit formation region;
- a connection terminal that is connected to a conductive pattern included in the wiring substrate and is provided on the circuit formation region;
- and
- a guard ring that includes a plurality of wiring layers and is provided on the peripheral region which is a region between the circuit formation region and the outer edge,
- wherein the predetermined potential is supplied to the guard ring from the power supply unit,
- wherein the guard ring is provided on a connection region, which overlaps with the wiring substrate, and
- in the connection region, a first wiring layer of the guard ring, which is the farthest from the semiconductor substrate, corresponds to a wiring layer closer to the semiconductor substrate relative to a second wiring layer of the connection terminal.
Dependencies are inferred from the claim text.