Semiconductor module

A semiconductor module comprising:

• a semiconductor chip having a light receiving region formed at a front thereof;
• a light preamble cover having
• a front,
• a back,
• a side, and
• an outer circumferential region at the front of the light preamble cover, the light preamble cover being disposed opposite to the front of the semiconductor chip such that the front of the semiconductor chip is covered by the back of the light preamble cover,
• a light shielding layer, formed of an insulation material, for blocking light from reaching the light receiving region, the light shielding layer having
• a first portion formed at the outer circumferential region, and
• a second portion formed on the side of the light preamble cover, a tip end of the second portion extending to a side of the semiconductor chip;
• a lens unit having
• a condensing part for condensing light onto the light receiving region via the light preamble cover, and
• a support part, fixed on the first portion of the light shielding layer at the outer circumferential region, for supporting the condensing part;
• and
• an adhesion layer on the semiconductor chip and having an opening formed at a central portion thereof,
• wherein the adhesion layer, the light preamble cover, the first portion and the support part are stacked in that stated order on the semiconductor chip,
• wherein the light shielding layer includes only the first and second portion so that the outer circumferential region at the front of the light preamble cover, the side of the light preamble cover, a side of the adhesion layer, and a portion of the side of the semiconductor chip are each directly covered by the light shielding layer such that no other part of the light preamble cover, the adhesion layer and the semiconductor chip is directly covered by the light shielding layer,
• wherein a signal sent from the lens unit reaches to the semiconductor chip through the intermediate layer.