Super Junction Semiconductor Device Comprising Implanted Zones
AssigneeInfineon Technologies Austria AG
InventorsArmin Willmeroth, Franz Hirler, Hans-Joachim Schulze, Uwe Wahl, Winfried Kaindl
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AssigneeInfineon Technologies Austria AG
InventorsArmin Willmeroth, Franz Hirler, Hans-Joachim Schulze, Uwe Wahl, Winfried Kaindl
Estimating the term…
In a semiconductor substrate with a first surface and a working surface parallel to the first surface, columnar first and second super junction regions of a first and a second conductivity type are formed. The first and second super junction regions extend in a direction perpendicular to the first surface and form a super junction structure. The semiconductor portion is thinned such that, after the thinning, a distance between the first super junction regions having the second conductivity type and a second surface obtained from the working surface does not exceed 30 μm. Impurities are implanted into the second surface to form one or more implanted zones. The embodiments combine super junction approaches with backside implants enabled by thin wafer technology.
A super junction semiconductor device comprising:
A super junction semiconductor device comprising:
A method of manufacturing a super junction semiconductor device, the method comprising:
Dependencies are inferred from the claim text.