LED Module

An LED module comprising:

• an electrically insulating main body having a base surface and a mounting surface located opposite the base surface;
• a plurality of electrical connection contacts arranged at the mounting surface, wherein the connection contacts do not adjoin the base surface;
• a heat sink arranged in the main body, the heat sink extending from the mounting surface as far as the base surface;
• and
• a plurality of LED chips, each LED chip having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side, wherein the LED chips are each arranged with the electrically insulating carrier substrate on the heat sink.

An LED module comprising:

• an electrically insulating main body having a base surface and a mounting surface located opposite the base surface;
• a plurality of electrical connection contacts arranged at the mounting surface, wherein the connection contacts do not adjoin the base surface;
• a heat sink arranged in the main body, the heat sink extending from the mounting surface as far as the base surface;
• and
• a plurality of LED chips, each LED chip having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side,
• wherein the LED chips are each arranged with the electrically insulating carrier substrate on the heat sink;
• wherein the electrically insulating carrier substrates of the LED chips comprise AlN or SiN;
• wherein the LED chips have no growth substrate;
• wherein the LED module is mounted onto a metal-core circuit board at the base surface;
• and
• wherein the heat sink is connected to a metal core of the metal-core circuit board.