Flattening method and flattening apparatus

An apparatus for flattening a surface of a substrate, comprising:

• a first surface removal processing unit configured to remove the surface of the substrate;
• a first transporter configured to transport the substrate to and from the first surface removal processing unit;
• a second surface removal processing unit configured to flatten the surface of the substrate;
• a second transporter configured to transport the substrate to and from the second surface removal processing unit;
• a cleaning unit configured to clean the substrate that has been processed by the first surface removal processing unit or the second surface removal processing unit;
• and
• a transport robot configured to transport the substrate between the first surface removal processing unit or the second surface removal processing unit and the cleaning unit,
• wherein the first surface removal processing unit comprises one or a combination of a grinding unit, a CMP unit, a lapping unit, and a light irradiation catalyst-referred etching unit,
• wherein the light irradiation catalyst-referred etching unit includes
• (i) a first polishing tool having a light-transmissive glass-type metal oxide formed on a surface thereof,
• (ii) a light source disposed below the first polishing tool and configured to irradiate the surface of the substrate with light through the first polishing tool,
• (iii) a first holder configured to hold the substrate,
• (iv) a first moving section configured to bring the surface of the substrate and the first polishing tool in contact with or close proximity to each other,
• (v) a first processing solution supply section configured to supply a first processing solution to the first polishing tool, and
• (vi) a first drive section coupled to the first polishing tool and the first holder for moving the first polishing tool and the first holder relative to each other,
• wherein the second surface removal processing unit comprises a catalyst-referred etching unit which includes
• (i) a second polishing tool having in a surface a catalyst selected from the group consisting of platinum, gold, a ceramic solid catalyst, a transition metal, glass, and an acidic or basic solid catalyst,
• (ii) a second holder configured to hold the substrate,
• (iii) a second moving section configured to bring the surface of the substrate and the second polishing tool in contact with or close proximity to each other,
• (iv) a second processing solution supply section configured to supply a second processing solution to the second polishing tool, and
• (v) a second drive section coupled to the second polishing tool and the second holder for moving the second polishing tool and the second holder relative to each other.