Pattern forming process

A pattern forming process comprising the steps of:

• coating a first chemically amplified resist composition onto a processable substrate, said first resist composition comprising a resin comprising recurring units having an acid labile group which is eliminatable with acid so that it may turn insoluble in an organic solvent developer as a result of the acid labile group being eliminated, a photoacid generator capable of generating an acid upon exposure to high-energy radiation, and a first organic solvent, prebaking the coating to remove the unnecessary solvent and to form a resist film, exposing patternwise the resist film to high-energy radiation, post-exposure baking, and developing in the organic solvent developer to form a first negative pattern,
• heating the first negative pattern to render it resistant to a second organic solvent used in a second resist composition to be subsequently coated,
• coating the second resist composition comprising a resin and the second organic solvent onto the negative pattern-bearing substrate, prebaking, exposing, post-exposure baking, and developing in an organic solvent developer to form a second negative pattern,
• whereby the negative pattern of the first resist composition and the negative pattern of the second resist composition are simultaneously formed.