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US 2014/0227513 A1Published application
Bioplastic molded body and method for producing bioplastic molded body
AssigneeNEC Corporation
InventorYukihiro Kiuchi
Life of this patent
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Abstract
The present invention relates to an electronic equipment case including: a polylactic acid resin-based substrate; a polylactic acid resin-based adhesion layer that is coated on the substrate; a resin layer that has high adhesiveness with the adhesion layer and is capable of being plated with a metal; and a metal plating that is formed on the resin layer. According to the present invention, a bioplastic molded body having sufficient electromagnetic wave shielding performance and a high-adhesion metal plating can be provided.
Claims6
A bioplastic molded body comprising:
- a polylactic acid resin-based substrate;
- a polylactic acid resin-based adhesion layer that is coated on the substrate;
- a resin layer that has high adhesiveness with the adhesion layer and is capable of being plated with a metal;
- and
- a metal plating that is formed on the resin layer.
2 more elements
A method of producing a bioplastic molded body, the method comprising:
- coating a polylactic acid resin-based adhesion layer coating material on a polylactic acid resin-based substrate to form an adhesion layer on the substrate;
- coating a resin layer coating material, which has high adhesiveness with the adhesion layer and is capable of being plated with a metal, on the adhesion layer to form a resin layer on the adhesion layer, and
- plating the resin layer with a metal.
Dependencies are inferred from the claim text.