Method, system for manufacturing a circuit board, and the circuit board thereof

A system for manufacturing a circuit board, the system including:

• a coating mechanism for continuously contacting a first layer of a first impermeable material to a second layer of bonding material at a pre-determined rate of motion;
• at least one coil winding mechanism for continuously contacting a third layer of a second impermeable material to the second layer;
• a UV source for carrying out B-staging the second layer;
• a first heating enclosure for carrying out pre-heating of the first layer with the B-staged second layer and the third layer;
• a laminator for applying pressure to the first layer with the B-staged second layer and the third layer;
• and
• a second heating enclosure for carrying out thermal curing of the B-staged second layer.

A circuit board, the circuit board including:

• a first layer of a first impermeable material, the first layer being cut from a continuous sheet;
• a second layer of a bonding material on the first layer;
• and
• a third layer of a second impermeable material on the second layer;
• wherein the first layer and the third layer are each bonded with the second layer, the first layer and the third layer each having an in-plane dimension that is at least ten times greater than a thickness of the second layer.