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US 2014/0227072 A1Published application
Wafer transfer blade and wafer transfer apparatus having the same
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-Yoon LEE, Jun-Young MUN, Dong-Il PARK, Suk-Yong JUNG, Bo-Young HWANG
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Abstract
A wafer transfer blade including a body including metal oxide and configured to support a wafer, and an adsorbing part on the body, the adsorbing part having at least one therein and configured to apply vacuum pressure to attach the wafer on the body may be provided. The body may include metal oxide to prevent static electricity.
Claims20
A wafer transfer blade comprising:
- a body configured to support a wafer, the body including metal oxide and at least one first vacuum hole defined therein, and the first vacuum hole configured to apply vacuum pressure therethrough such that the wafer is attached to the body.
A wafer transfer blade comprising:
- a body configured to support a wafer, the body including metal oxide;
- a first guide wall at a first end of the body;
- and
- a second guide wall at a second end of the body, the second end being opposite to the first end.
1 more element
A wafer transfer blade comprising:
- a body configured to support a wafer, the body including metal oxide and including a wafer holding portion configured to hold the wafer.
Dependencies are inferred from the claim text.