Film deposition apparatus and film deposition method
AssigneeTokyo Electron Limited
InventorsHitoshi Kato, Manabu Honma, Yasushi Takeuchi
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AssigneeTokyo Electron Limited
InventorsHitoshi Kato, Manabu Honma, Yasushi Takeuchi
Estimating the term…
A film deposition apparatus includes a separation member that extends to cover a rotation center of the turntable and two different points on a circumference of the turntable above the turntable, thereby separating the inside of the chamber into a first area and a second area; a first reaction gas supplying portion that supplies a first reaction gas toward the turntable in the first area; a second reaction gas supplying portion that supplies a second reaction gas toward the turntable in the second area; a first evacuation port that evacuates the first reaction gas and the first separation gas that converges with the first reaction gas; and a second evacuation port that evacuates the second reaction gas and the first separation gas that converges with the second reaction gas. The separation member has a bent portion that substantially fills in a gap between the turntable and the chamber.
A film deposition apparatus for depositing a film on a substrate by performing plural cycles of alternately supplying at least two kinds of reaction gases that react with each other on the substrate to produce a layer of a reaction product in a chamber, the film deposition apparatus comprising:
A film deposition method for depositing a film on a substrate by carrying out plural cycles of alternately supplying at least two kinds of reaction gases that react with each other on the substrate to produce a layer of a reaction product in a chamber, the film deposition method comprising steps of:
Dependencies are inferred from the claim text.