Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTatsuhiko KOIDE, Yoshihiro OGAWA, Masahiro KIYOTOSHI
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Abstract
A semiconductor manufacturing apparatus according to the present embodiment comprises a chamber. A chemical-agent supply part is configured to supply a water-repellent agent or an organic solvent to a surface of a semiconductor substrate having been cleaned with a cleaning liquid in the chamber. A spray part is configured to spray a water-capture agent capturing water into an atmosphere in the chamber.
Claims19
A semiconductor manufacturing apparatus comprising:
- a chamber;
- a chemical-agent supply part supplying a water-repellent agent or an organic solvent to a surface of a semiconductor substrate having been cleaned with a cleaning liquid in the chamber;
- and
- a spray part spraying a water-capture agent capturing water into an atmosphere in the chamber.
A manufacturing method of a semiconductor device for manufacturing the semiconductor device using a semiconductor manufacturing apparatus, which comprises a chamber, a chemical-agent supply part supplying a water-repellent agent or an organic solvent into the chamber, and a spray part spraying a water-capture agent capturing water into the chamber, the method comprising:
- arranging a semiconductor substrate having been cleaned with a cleaning liquid in the chamber;
- spraying the water-capture agent capturing water into an atmosphere in the chamber;
- and
- supplying the water-repellent agent or the organic solvent to a surface of the semiconductor substrate either simultaneously with or after spraying of the water-capture agent.
Dependencies are inferred from the claim text.