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US 2014/0211439 A1Published application
Circuit assembly
AssigneeTexas Instruments Incorporated
InventorMark Allen Gerber
Life of this patent
Estimating the term…
Abstract
A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.
Claims21
A circuit assembly comprising:
- a substrate having a substrate electrical circuit and having opposite top and bottom substrate surfaces, a substrate hole extending through said substrate;
- and
- a discrete component assembly comprising a discrete component electrically connected to said substrate electrical circuit and a support member attached to said discrete component, at least a portion of said discrete component being physically mounted in said substrate hole.
A method of making a circuit package comprising:
- making a hole in a substrate;
- mounting a discrete component in the hole;
- and
- electrically connecting the discrete component to the substrate.
1 more element
A method of making a dual leadframe circuit package comprising:
- positioning a first end portion of a discrete component in a hole in a first leadframe and connecting the discrete component to the first leadframe;
- and
- positioning a second end portion of the discrete component in a hole in a second leadframe and connecting the discrete component to the second leadframe.
Dependencies are inferred from the claim text.