Encapsulation structure for an optoelectronic component and method for encapsulating an optoelectronic component

An encapsulation arrangement, comprising:

• an optoelectronic component having at least one functional layer;
• an encapsulation structure formed above the at least one functional layer, the encapsulation structure, comprising:
• a barrier thin-film layer for protecting an optoelectronic component against chemical impurities;
• a cover layer applied above the barrier thin-film layer and serving for protecting the barrier thin-film layer against mechanical damage;
• and
• an intermediate layer applied on the barrier thin-film layer between barrier thin-film layer and cover layer and comprising a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface, and that after the intermediate layer has been cured, mechanical loads on the barrier thin-film layer as a result of particle impurities during the application of the cover layer are reduced by the intermediate layer.

A method for encapsulating an optoelectronic component, the method comprising:

• applying a barrier thin-film layer on or above an optoelectronic component for protecting the optoelectronic component against chemical impurities;
• applying an intermediate layer on the barrier thin-film layer, wherein the intermediate layer comprises a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface;
• curing the intermediate layer;
• and
• applying a cover layer above the cured intermediate layer for protecting the barrier thin-film layer against mechanical damage,
• wherein the curable material of the intermediate layer is designed such that after the intermediate layer has been cured, said intermediate layer has a hardness such that mechanical loads on the barrier thin-film layer that are caused as a result of particle impurities during the application of the cover layer are reduced by means of the intermediate layer.