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US 2014/0210110 A1Published application
Attachment of microelectronic components
AssigneeSeagate Technology LLC
InventorRalph Kevin Smith
Life of this patent
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Abstract
Sub-micron precision alignment between two microelectronic components can be achieved by applying energy to incite an exothermic reaction in alternating thin film reactive layers between the two microelectronic components. Such a reaction rapidly distributes localized heat to melt a solder layer and form a joint without significant shifting of components.
Claims20
A method comprising:
- depositing a first reactive thin film layer on a first microelectronic component;
- aligning the first microelectronic component with a second microelectronic component;
- applying energy to incite an exothermic reaction between the first reactive thin film layer and at least one other reactive thin film layer to form a joint between the first microelectronic component and the second microelectronic component.
An apparatus comprising:
- a first microelectronic component to be aligned with a second microelectronic component;
- a first reactive thin film layer deposited on the first microelectronic component;
- at least one other reactive thin film layer to exothermically react with the first reactive thin film layer when energy is applied to form a joint between the first and second microelectronic components.
The apparatus of 10, wherein the insulating layer is solder.
A system comprising:
- a slider to be aligned with and bonded to a laser submount assembly;
- a first reactive thin film layer deposited on at least one of the slider or the laser submount assembly;
- at least one other thin film layer to exothermically react with the first reactive thin film layer when energy is applied to form a joint between the slider and the laser submount assembly.
Dependencies are inferred from the claim text.