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US 2014/0210083 A1Published application
Thermally and electrically enhanced ball grid array package
AssigneeBroadcom Corporation
InventorsSam Ziqun Zhao, Reza-ur Rahman Khan, Edward Law, Marc Papageorge
Life of this patent
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Abstract
In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.
Claims20
A device package, comprising:
- a substrate having first and second opposing surfaces, wherein an opening is formed through the first and second surfaces of the substrate;
- a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate;
- and
- an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate.
1 more element
A device package, comprising:
- a substrate having first and second opposing surfaces;
- a stiffener coupled to the first surface of the substrate, wherein the substrate comprises a plurality of conductive paths extending between the first and second surfaces of the substrate and contacting the stiffener;
- and
- an integrated circuit (IC) die coupled to the stiffener and electrically coupled to the substrate.
1 more element
Dependencies are inferred from the claim text.