PoP Device

A package-on-package (PoP) device comprising:

• a die;
• a chip coupled to the die;
• a redistribution layer (RDL) coupled to the chip, wherein the chip is embedded between the die and the RDL;
• and
• a ball grid array (BGA) coupled to the RDL, wherein the RDL provides electrical coupling between the BGA and both the die and the chip without using through vias.

A method of forming a package-on-package (PoP) device comprising:

• placing an adhesive layer on a carrier substrate;
• coupling a plurality of chip packages to the adhesive layer on the carrier substrate;
• placing a bonding layer on the chip packages;
• coupling a plurality of chips to the bonding layer on the chip packages;
• encapsulating with a molding compound the chip packages and the chips on the carrier substrate;
• grinding the molding compound to expose a plurality of connecting elements of the chips and a plurality of second connecting elements of the chip packages;
• forming a redistribution layer (RDL) on the molding compound and the exposed connecting elements and second connecting elements;
• forming a ball grid array (BGA) on the RDL;
• and
• de-bonding the carrier substrate.