Integrated circuit system with distributed power supply

A chip package comprising:

• a substrate;
• an interposer die bonded to the substrate;
• a first integrated circuit comprising:
• a planar surface;
• first bond pads on the planar surface, the first integrated circuit electrically connected to the interposer at a first position of the interposer via the first bond pads;
• second bond pads on a back surface of the first integrated circuit, the back surface being opposite the planar surface;
• and
• at least two circuit blocks, the at least two circuit blocks being configured to operate at different operating voltages;
• at least one voltage regulator module electrically connected to the back surface of the first integrated circuit via the second bond pads, the at least one voltage regulator module being configured to convert a received power supply voltage to the respective operating voltage of a respective one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads;
• and
• an electrical connection configured to electrically connect the at least one voltage regulator module to a supply pad.

An integrated circuit system comprising:

• an interposer;
• a first integrated circuit comprising:
• first bond pads on a front surface of the first integrated circuit, the first integrated circuit electrically connected to the interposer at a first position of the interposer via the first bond pads;
• second bond pads on a back surface of the first integrated circuit, the back surface being opposite the front surface;
• at least two circuit blocks comprising a first circuit block and a second circuit block, the first circuit block and the second circuit block being adapted to operate at different operating voltages;
• at least one voltage regulator module electrically connected to the back surface of the first integrated circuit via the second bond pads, the at least one voltage regulator module being configured to convert a received power supply voltage to the respective operating voltage of a respective one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads,
• wherein the second bond pads are formed in an area of the first circuit block.