Methods for processing substrates

A method for processing a substrate, the method comprising:

• sequentially forming a first thermosetting glue layer and a thermosetting release layer on the substrate;
• providing a second thermosetting glue layer to the release layer between the substrate and a carrier to bond the substrate to the carrier;
• thinning the substrate while the substrate is supported by the carrier to produce a thinned substrate;
• separating the carrier and the second glue layer from the release layer;
• and
• cleaning the thinned substrate to remove the release layer and the first glue layer from the thinned substrate.

A method for processing a substrate, the method comprising:

• forming a first thermosetting glue layer on the substrate and a first thermosetting release layer on the first thermosetting glue layer;
• forming a second thermosetting glue layer on a carrier;
• bonding the substrate to the carrier;
• processing the substrate while the substrate is supported by the carrier;
• and
• removing the carrier from the substrate.