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US 2014/0210071 A1Published application
Integrated structure with improved heat dissipation
AssigneesSTMicroelectronics (Crolles 2) SAS, STMicroelectronics S.r.l.
InventorsLaurent-Luc Chapelon, Pascal Ancey, Sandrine Lhostis
Life of this patent
Estimating the term…
Abstract
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material.
Claims20
An integrated structure, comprising:
- a substrate supporting at least one chip;
- and
- a heat dissipating housing, attached to the chip, being thermally conductive and having a thermal expansion compatible with the chip.
An integrated structure, comprising:
- an integrated circuit chip having a front side with an interconnection network and a back side with a formed cavity;
- and
- a heat dissipating structure, attached to the chip within said cavity on the back side, being thermally conductive and having a thermal expansion compatible with the integrated circuit chip.
An integrated structure, comprising:
- an integrated circuit chip having a front side with an interconnection network and a back side;
- and
- a heat dissipating structure, attached to the interconnection network on the front side of the chip, being thermally conductive and having a thermal expansion compatible with the integrated circuit chip.
Dependencies are inferred from the claim text.