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US 2014/0210069 A1Published application
Chip package and manufacturing method thereof
AssigneePixart Imaging Incorporation
InventorsYi-Chang Chang, Yen-Hsin Chen, Chi-Chih Shen
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Abstract
The present invention discloses a chip package and a manufacturing method thereof. The chip package includes: a semiconductor chip having an upper surface and a lower surface opposite to each other; a metal heat conductive layer formed on the lower surface, for conducting or absorbing heat generated by the semiconductor chip; and a bond pad formed on the upper surface, for electrically connecting to a circuit in the semiconductor chip.
Claims11
A chip package, comprising:
- a semiconductor chip having an upper surface and a lower surface opposite to each other;
- a metal heat conductive layer formed on the lower surface, for conducting or absorbing heat generated by the semiconductor chip;
- and
- a bond pad formed on the upper surface, for electrically connecting with a circuit in the semiconductor chip.
1 more element
A manufacturing method of a chip package, comprising:
- providing a semiconductor chip having an upper surface and a lower surface opposite to each other;
- forming a metal heat conductive layer on the lower surface, for conducting or absorbing heat generated by the semiconductor chip;
- and
- forming a bond pad on the upper surface, for electrically connecting with a circuit in the semiconductor chip.
1 more element
Dependencies are inferred from the claim text.