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US 2014/0210064 A1Published application
Wire bonding method and structure
AssigneeTexas Instruments Incorporated
InventorsOsvaldo Jorge Lopez, Jonathan Almeria Noquil, Juan Herbsommer
Life of this patent
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Abstract
An integrated circuit (“IC”) assembly includes an IC die with a metallization layer on a top surface thereof. A plurality of lead wires are bonded at first end portions thereof to the metallization layer. A conductive layer is attached to the metallization layer and covers the first ends of the lead wires.
Claims20
An integrated circuit (“IC”) assembly comprising:
- an IC die having a metallization layer on a first surface thereof;
- a plurality of lead wires having first ends and second ends, said first ends being bonded to said top metallization layer;
- and
- conductive epoxy layer attached to said top metallization layer and covering said first ends of said lead wires after said lead wires have been bonded.
1 more element
A method of attaching an integrated circuit (“IC”) die to external circuitry comprising:
- bonding first ends of a plurality of lead wires to a top metallization layer on a top side of the IC die;
- and
- covering the first ends of the plurality of lead wires and at least a portion of the metallization layer with a layer of conductive epoxy material after said bonding.
A power quad flat no-lead (“PQFN”) package comprising:
- a leadframe comprising a die pad portion and at least one lead portion integrally formed with said die pad portion;
- an integrated circuit (“IC”) die having a bottom surface and a top surface opposite said bottom surface, said bottom surface of said IC die being mounted on said die pad portion;
- said top surface of said IC die having a top metallization layer;
- a plurality of lead wires each having first ends and second ends, said first ends being ball bonded to said top metallization layer;
- said second ends being wedge bonded to said at least one lead portion;
- a conductive epoxy layer attached to said top metallization layer and covering said first ends of said lead wires after said lead wires have been bonded;
- and
- a layer of mold material covering said IC die and said lead wires and a portion of said leadframe and exposing an end portion of said at least one lead portion and a bottom surface of said die pad portion.
5 more elements
Dependencies are inferred from the claim text.