Semiconductor device having inductor
AssigneeVIA Technologies, Inc.
InventorSheng-Yuan LEE
Life of this patent
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AssigneeVIA Technologies, Inc.
InventorSheng-Yuan LEE
Estimating the term…
A semiconductor device including a first insulating layer and a second insulating layer sequentially disposed on a substrate is disclosed. A first conductive line and a second conductive line are disposed in the first insulating layer, and each of the first and second conductive lines has a first end and a second end, wherein the second ends of the first and second conductive lines are coupled to each other. A first winding portion and a second winding portion are disposed in the second insulating layer, and each of the first and second winding portions includes a third conductive line and a fourth conductive line arranged from the inside to the outside. Each of the third and fourth conductive lines has a first end and a second end, wherein the first and second conductive lines overlap at least a portion of the third conductive lines.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.