Solid-state imaging device and method for manufacturing the same

A method for manufacturing a solid-state imaging device including a pixel unit, the method comprising:

• forming a plurality of photodiodes in the pixel unit in a semiconductor substrate;
• forming, on the semiconductor substrate, a first insulating film which covers the photodiodes;
• selectively forming a recess in a portion of the first insulating film, the portion being located above each of the photodiodes;
• forming an optical waveguide by forming, on the first insulating film, a second insulating film which embeds the recess, the optical waveguide guiding light to a corresponding one of the photodiodes;
• forming a conductive film on the second insulating film in an area outside of the pixel unit;
• forming a third insulating film on the second insulating film and on the conductive film;
• reducing a difference in level which results from the conductive film and the second insulating film, by reducing a film thickness of the third insulating film formed on the conductive film and near the conductive film in the area outside of the pixel unit;
• and
• forming, in the pixel unit, a partition which penetrates the third insulating film.