Lithography apparatus, lithography method, and method of manufacturing article

A method of manufacturing an article, the method comprising:

• forming a pattern on a substrate using a lithography apparatus;
• and
• processing the substrate on which the pattern has been formed to manufacture the article,
• wherein the lithography apparatus forms the pattern sequentially in each of a plurality of shot regions on the substrate, and includes:
• a measurement device configured to measure a position of a shot region on the substrate;
• and
• a controller configured to control the measurement device and obtain a position of each of the plurality of shot regions based on measurement by the measurement device,
• wherein the controller is configured:
• to cause the measurement device to measure a position of each of a plurality of sample shot regions on the substrate, and to obtain, based on a position of each of a plurality of second shot regions, of the plurality of sample shot regions, obtained by first regression calculation based on a measurement value of a position of each of a plurality of first shot regions of the plurality of sample shot regions, and a measurement value of a position of each of the plurality of second shot regions, a measurement error with respect to each of the plurality of second shot regions and
• to cause, after forming the pattern in at least one of the plurality of shot regions, the measurement device to measure a position of each of shot regions, of the plurality of second shot regions, in a partial area on the substrate where the pattern is to be formed, and to obtain positions of shot regions in the partial area by second regression calculation based on measurement values of the positions of the shot regions in the partial area and the obtained measurement errors.

A lithography apparatus for forming a pattern in each of a plurality of shot regions on a substrate, the apparatus comprising:

• a measurement device configured to measure a position of a shot region on the substrate;
• and
• a controller configured to control the measurement device and obtain a position of each of the plurality of shot regions based on measurement by the measurement device,
• wherein the controller is configured:
• to cause the measurement device to measure a position of each of a plurality of sample shot regions on the substrate, and to obtain, based on a position of each of a plurality of second shot regions, of the plurality of sample shot regions, obtained by first regression calculation based on a measurement value of a position of each of a plurality of first shot regions of the plurality of sample shot regions, and a measurement value of a position of each of the plurality of second shot regions, a measurement error with respect to each of the plurality of second shot regions and
• to cause, after forming the pattern in one partial area of the plurality of shot regions, the measurement device to measure a position of each of a plurality of shot regions with respect to another partial area of the plurality of shot regions where the pattern is to be formed, and to obtain a position of the other partial area by second regression calculation based on the measured positions with respect to the other partial area and the obtained measurement errors.

A lithography apparatus for forming a pattern in each of a plurality of shot regions on a substrate, the apparatus comprising:

• a measurement device configured to measure a position of a shot region on the substrate;
• and
• a controller configured to control the measurement device and obtain a position of each of the plurality of shot regions based on measurement by the measurement device,
• wherein the measurement device includes a first detector for obtaining measurement result at a first precision, and a second detector for obtaining measurement result at a second precision lower than the first precision,
• the controller is configured:
• to cause the measurement device to measure a position of each of a plurality of sample shot regions on the substrate using the first detector, and to obtain a position of each of the plurality of shot regions by first regression calculation based on a measurement value of a position of each of a plurality of first shot regions of the plurality of sample shot regions, and
• to cause, before and after forming the pattern in one partial area of the plurality of shot regions, the measurement device to measure, using the second detector, a position of each of a plurality of shot regions with respect to another partial area of the plurality of shot regions where the pattern is to be formed, and to obtain a position of the other partial area by second regression calculation based on the two types of positions respectively obtained before and after forming the pattern, and a position of each of the plurality of shot regions obtained by the first regression calculation.

A lithography method of forming a pattern in each of a plurality of shot regions on a substrate,

• wherein the method uses a first detector for obtaining a measurement result at a first precision, and a second detector for obtaining a measurement result at a second precision lower than the first precision, the method comprising steps of:
• measuring a position of each of a plurality of sample shot regions on the substrate using the first detector, and obtaining a position of each of the plurality of shot regions by first regression calculation based on a measurement value of a position of each of a plurality of first shot regions of the plurality of sample shot regions;
• and
• measuring, before and after forming the pattern in one partial area of the plurality of shot regions, using the second detector, a position of each of a plurality of shot regions with respect to another partial area of the plurality of shot regions where the pattern is to be formed, and obtaining a position of the other partial area by second regression calculation based on the two types of positions respectively obtained before and after forming the pattern, and a position of each of the plurality of shot regions obtained by the first regression calculation.

A method of manufacturing an article, the method comprising:

• forming a pattern on a substrate using a lithography apparatus;
• and
• processing the substrate on which the pattern has been formed to manufacture the article,
• wherein the lithography apparatus forms the pattern sequentially in each of a plurality of shot regions on the substrate,
• the lithography apparatus includes:
• a measurement device configured to measure a position of a shot region on the substrate;
• and
• a controller configured to control the measurement device and obtain a position of each of the plurality of shot regions based on measurement by the measurement device,
• wherein the controller is configured:
• to cause the measurement device to measure a position of each of a plurality of sample shot regions on the substrate, and to obtain, based on a position of each of a plurality of second shot regions, of the plurality of sample shot regions, obtained by first regression calculation based on a measurement value of a position of each of a plurality of first shot regions of the plurality of sample shot regions, and a measurement value of a position of each of the plurality of second shot regions, a measurement error with respect to each of the plurality of second shot regions and
• to cause, after forming the pattern in one partial area of the plurality of shot regions, the measurement device to measure a position of each of a plurality of shot regions with respect to another partial area of the plurality of shot regions where the pattern is to be formed, and to obtain a position of the other partial area by second regression calculation based on the measured positions with respect to the other partial area and the obtained measurement errors.

A method of manufacturing an article, the method comprising:

• forming a pattern on a substrate using a lithography apparatus;
• and
• processing the substrate on which the pattern has been formed to manufacture the article,
• wherein the lithography apparatus forms the pattern sequentially in each of a plurality of shot regions on the substrate,
• the lithography apparatus includes:
• a measurement device configured to measure a position of a shot region on the substrate;
• and
• a controller configured to control the measurement device and obtain a position of each of the plurality of shot regions based on measurement by the measurement device,
• wherein the measurement device includes a first detector for obtaining measurement result at a first precision, and a second detector for obtaining measurement result at a second precision lower than the first precision,
• the controller is configured:
• to cause the measurement device to measure a position of each of a plurality of sample shot regions on the substrate using the first detector, and to obtain a position of each of the plurality of shot regions by first regression calculation based on a measurement value of a position of each of a plurality of first shot regions of the plurality of sample shot regions, and
• to cause, before and after forming the pattern in one partial area of the plurality of shot regions, the measurement device to measure, using the second detector, a position of each of a plurality of shot regions with respect to another partial area of the plurality of shot regions where the pattern is to be formed, and to obtain a position of the other partial area by second regression calculation based on the two types of positions respectively obtained before and after forming the pattern, and a position of each of the plurality of shot regions obtained by the first regression calculation.