Exhaust system and apparatus for fabricating semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorRyo KIKUCHI
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Abstract
An aspect of one embodiment, there is provided an exhaust system includes a vacuum pump exhausting first gas, a trap bottle having a cylindrical shape, a sidewall of the trap bottle being configured to move in a circumference direction, and a first pipe connecting between the vacuum pump and the trap bottle, the first pipe having a tilt angle in an axis direction of the cylindrical shape, the first gas flowing in the first pipe from the vacuum pump to the trap bottle.
Claims19
An exhaust system, comprising:
- a vacuum pump exhausting first gas;
- a trap bottle having a cylindrical shape, a sidewall of the trap bottle being configured to move in a circumference direction;
- and
- a first pipe connecting between the vacuum pump and the trap bottle, the first pipe having a tilt angle in an axis direction of the cylindrical shape, the first gas flowing in the first pipe from the vacuum pump to the trap bottle.
An apparatus for fabricating a semiconductor device, the apparatus comprising, a chamber, a first vacuum pump connected to the chamber, an exhaust system connected to the first vacuum pump, the exhaust system comprising:
- a second vacuum pump configured to exhausting a first gas;
- a trap bottle having a cylindrical shape, a sidewall of the trap bottle being configured to move in a circumference direction;
- a first pipe connecting between the second vacuum pump and the trap bottle, the first pipe having a tilt angle in an axis direction of the cylindrical shape, the first gas flowing in the first pipe from the second vacuum pump to the trap bottle.
Dependencies are inferred from the claim text.