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US 2014/0208590 A1Published application
Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate
AssigneeNVIDIA Corporation
InventorsLeilei Zhang, Ronilo V. Boja, Abraham Fong Yee, Zuhair Bokharey
Life of this patent
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Abstract
A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.
Claims20
A method, comprising:
- forming one or more holes in a thick substrate using a laser drilling technique;
- electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes;
- and
- filling the one or more plated holes with a non-conductive material.
1 more element
A printed circuit board, comprising:
- a thick substrate;
- and
- a plurality of high-density microvias in the thick substrate created by:
- forming one or more holes in the thick substrate using a laser drilling technique,
- electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and
- filling the one or more plated holes with a non-conductive material.
3 more elements
A system, comprising;
- a printed circuit board comprising a thick substrate and a plurality of high-density microvias in the thick substrate created by:
- forming one or more holes in the thick substrate using a laser drilling technique,
- electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and
- filling the one or more plated holes with a non-conductive material;
- and
- one or more electrical components coupled to the printed circuit board.
3 more elements
Dependencies are inferred from the claim text.