Multi-camera sensor for three-dimensional imaging of a circuit board

A method of three-dimensionally mapping an image of a circuit board, the method comprising:

• projecting a pattern image onto the circuit board from a first incident angle;
• simultaneously capturing a first plurality of fringe phase images of the circuit board from a second incident angle and a third incidence angle;
• simultaneously capturing a second plurality of fringe phase images of the circuit board from the second incidence angle and the third incident angle;
• simultaneously capturing a third plurality of fringe phase images of the circuit board from the second incidence angle and the third incidence angle;
• wherein the first, second and third pluralities of fringe phase images are captured while patterned illumination is disposed on the circuit board;
• and
• computing a height map based on the first, second, and third plurality of fringe phase images.

A system for generating a three-dimensional height image of a test target, the system comprising:

• an illumination source configured to generate a patterned illumination on the test surface;
• a first camera configured to acquire a first image of the patterned illumination from a first point of view;
• a second camera configured to acquire a second image of the patterned illumination from a second point of view;
• the first and second cameras having different configurations;
• and
• a controller coupled to the illumination source and to the first and second cameras, the controller being configured to generate a height image of the test surface based on the first and second images acquired of said patterned illumination, the height image being enhanced by a combination of the different configurations of the first and second cameras.

A system for generating a three-dimensional height image of a test target, the system comprising:

• an illumination source configured to generate a patterned illumination on the test target;
• a first pair of cameras configured to acquire a first image pair of the patterned illumination from a first point of view;
• a second pair of cameras configured to acquire a second image pair of the patterned illumination from a second point of view;
• the first and second pairs of cameras having different configurations;
• and
• a controller coupled to the source and to the first and second pairs of cameras, the controller being configured to generate a height image of the test target based on first and second image pairs acquired of said patterned illumination, the height image being enhanced by a combination of the different configurations of the first and second image pairs.

A method of three-dimensionally mapping an image of a test surface, the method comprising:

• projecting a plurality of illumination patterns onto the test surface from a first point of view;
• capturing a first plurality of images of the test surface from a second point of view with a first camera configuration while the illumination patterns are disposed upon the test surface;
• capturing a second plurality of images of the test surface from a third point of view with a second camera configuration while illumination patterns are disposed upon the test surface;
• computing a height map of the test surface using the first and second plurality of illumination patterns images captured by the first and second camera configurations.