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US 2014/0197915 A1Published application
Electronic component
AssigneeTaiyo Yuden Co., Ltd.
InventorsMasahiro SATO, Motoyuki TAJIMA, Kaoru SAKINADA
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Abstract
An electronic component includes: a wiring substrate; a passive component that includes a substrate, a coil located on an upper surface of the substrate, and a terminal located on a lower surface of the substrate and electrically connected to the coil, and is mounted on an upper surface of the wiring substrate by using the terminal; and a grounding wiring that is located on the wiring substrate and overlaps with the coil in a thickness direction of the wiring substrate.
Claims7
An electronic component comprising:
- a wiring substrate;
- a passive component that includes a substrate, a coil located on an upper surface of the substrate, and a terminal located on a lower surface of the substrate and electrically connected to the coil, and is mounted on an upper surface of the wiring substrate by using the terminal;
- and
- a grounding wiring that is located on the wiring substrate and overlaps with the coil in a thickness direction of the wiring substrate.
1 more element
Dependencies are inferred from the claim text.