Diplexer design using through glass via technology

A diplexer, comprising:

• a first port;
• a second port;
• a third port;
• a low pass filter between two of the first port, the second port and the third port:
• and
• a second pass filter between two other of the first port, the second port and the third port, the second pass filter comprising a band pass filter or a high pass filter.

A method of fabricating a diplexer, comprising:

• forming a plurality of through substrate vias in a substrate;
• depositing a first plurality of traces on a first surface of the substrate;
• depositing a second plurality of traces on a second surface of the substrate;
• coupling the first plurality of traces to first sides of the plurality of through substrate vias;
• coupling the second plurality of traces to second sides of the plurality of through substrate vias to form a serpentine 3D inductor;
• and
• forming a capacitor on the substrate.

An diplexer comprising:

• a substrate having a plurality of through substrate vias;
• a first plurality of traces on a first surface of the substrate;
• first means for coupling the plurality of through substrate vias on the first surface of the substrate;
• second means for coupling opposite ends of the plurality of through substrate vias on a second surface of the substrate opposite the first surface, the first plurality of traces and the first means for coupling and the second means for coupling operating as a 3D inductor;
• and
• means for storing charge supported by the substrate.

A method of fabricating a diplexer, comprising:

• the step of forming a plurality of through substrate vias in a substrate;
• the step of depositing a first plurality of traces on a first surface of the substrate;
• the step of depositing a second plurality of traces on a second surface of the substrate;
• the step of coupling the first plurality of traces to first sides of the plurality of through substrate vias;
• the step of coupling the second plurality of traces to second sides of the plurality of through substrate vias to form a serpentine 3D inductor;
• and
• the step of forming a capacitor on the substrate.