Test Equipment for Testing Semiconductor Device and Methods of Testing Semiconductor Device Using the Same

A method of testing a semiconductor device, the method comprising:

• loading an undivided printed circuit board (PCB) in a test equipment, wherein the undivided PCB includes a plurality of unit PCBs, each unit PCB including a semiconductor device;
• moving the undivided PCB to an electrical connection test chamber of the test equipment;
• confirming product information of the undivided PCB disposed in the electrical connection test chamber using a code recognition unit of the electrical connection test chamber;
• transmitting the product information of the undivided PCB to an electrical connection test unit of the electrical connection test chamber, the electrical connection test unit being directly connected to a cloud server;
• performing an electrical connection test of the undivided PCB using the product information using the electrical connection test unit;
• electrically connecting the undivided PCB, which has passed the electrical connection test, to one of a plurality of main testers of the test equipment, the main testers being discretely connected to the cloud server;
• transmitting the product information of the undivided PCB to the main tester electrically connected to the undivided PCB;
• using the main tester, performing a main test of the undivided PCB using the transmitted product information;
• recording results of the main test on the undivided PCB on which the main test has been performed by the main tester;
• and
• classifying the undivided PCB on which the results of the main test are recorded based on the results of the main test.

A method of testing a semiconductor device, the method comprising:

• loading an undivided printed circuit board (PCB) in a loading area of a test equipment, wherein the undivided PCB includes a plurality of unit PCBs, each unit PCB including a semiconductor device;
• confirming product information of the undivided PCB using a code recognition unit disposed at the loading area;
• conveying the undivided PCB to a testing area of the test equipment;
• electrically connecting the undivided PCB to a main tester at the testing area;
• receiving firmware corresponding to the product information from a cloud server at the main tester;
• and
• performing a main test of the undivided PCB at the main tester using the received firmware.