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US 2014/0197551 A1Published application
Method for Fabricating a Semiconductor Chip Panel
AssigneeInfineon Technologies AG
InventorsDaniel Porwol, Edward Fuergut
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Abstract
The method comprises providing a carrier, providing a plurality of semiconductor chips, the semiconductor chips each comprising a first main face and a second main face opposite to the first main face and side faces connecting the first and second main faces, placing the semiconductor chips on the carrier with the second main faces facing the carrier, and applying an encapsulation material to the side faces of the semiconductor chips.
Claims20
A method for fabricating a semiconductor chip panel, the method comprising:
- providing a carrier;
- providing a plurality of semiconductor chips, the semiconductor chips each comprising a first main face and a second main face opposite to the first main face and side faces connecting the first and second main faces;
- placing the semiconductor chips on the carrier with the second main faces facing the carrier;
- and
- applying an encapsulation material to the side faces of the semiconductor chips.
2 more elements
A semiconductor chip package, comprising:
- a semiconductor chip comprising a first main face and a second main face opposite to the first main face and side faces connecting the first and second main faces;
- and
- an encapsulation material covering the side faces of the semiconductor chip, wherein the encapsulation material is not applied on the first and second main faces.
A semiconductor chip package, comprising:
- a semiconductor chip module comprising two or more semiconductor chips, wherein at least one of the semiconductor chips comprises a first main face and a second main face opposite to the first main face and side faces connecting the first and second main faces;
- and
- an encapsulation material covering the side faces of the at least one semiconductor chip.
Dependencies are inferred from the claim text.