Semiconductor device

A semiconductor device, comprising:

• a substrate;
• a semiconductor chip mounted on an upper surface of the substrate via a first adhesive layer;
• an electronic component mounted on the upper surface of the substrate via a second adhesive layer and disposed apart from the semiconductor chip;
• a bonding wire electrically connecting a conductive pad disposed on the substrate and a conductive pad disposed on the semiconductor chip to electrically connect the conductive pad disposed on the substrate and the conductive pad disposed on the electronic component;
• and
• a sealing member covering the substrate, the first adhesive layer, the semiconductor chip, the second adhesive layer, the electronic component, and the bonding wire,
• wherein the length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and an upper surface of the semiconductor chip is located farther from the upper surface of the substrate than an upper surface of the electronic component.

A semiconductor device, comprising:

• a substrate;
• a height adjuster mounted on a surface of the substrate via a first adhesive layer;
• a semiconductor chip mounted on the height adjuster via a second adhesive layer;
• an electronic component mounted on the height adjuster via a third adhesive layer;
• a bonding wire electrically connecting a conductive pad disposed on the substrate and a conductive pad disposed on the semiconductor chip to electrically connect the conductive pad disposed on the substrate and the conductive pad disposed on the electronic component;
• a passive component mounted on the surface of the substrate via a fourth adhesive layer;
• and
• a sealing member covering the substrate, the first adhesive layer, the height adjuster, the second adhesive layer, the semiconductor chip, the third adhesive layer, the electronic component, the fourth adhesive layer, the passive component, and the bonding wire,
• wherein the length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the length of the passive component in the first direction is greater than the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction.