Semiconductor package and method of manufacturing the same

A method of manufacturing a semiconductor package, the method comprising:

• forming at least one bond finger on an upper surface of a package substrate;
• forming at least one dummy finger on the upper surface of the package substrate;
• attaching a semiconductor chip to the upper surface of the package substrate using a die attach film;
• electrically connecting the semiconductor chip with the at least one bond finger;
• and
• forming a molding member on the upper surface of the package substrate to cover the semiconductor chip and the at least one dummy finger,
• wherein the at least one dummy finger includes a material that does not closely adhere to the molding member to format least one first discharge passageway between the at least one dummy finger and the molding member.

A semiconductor package comprising:

• a package substrate including at least one bond finger;
• a semiconductor chip on the bond finger, the semiconductor chip electrically connected to the package substrate through the bond finger;
• a die attach film between the semiconductor chip and the package substrate, the die attach film attaching the semiconductor chip to the package substrate;
• a molding member on the package substrate;
• and
• at least one dummy finger between the package substrate and the molding member and surrounding the die attach film, the at least one dummy finger configured to not closely adhere to the molding member to provide at least one discharge passage between the at least one dummy finger and the molding member.