Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region;
• forming an insulation cover on the lead-frame and on the metal connector;
• connecting an integrated circuit die over the insulation cover;
• forming an under-fill between the integrated circuit die and the insulation cover;
• forming a top encapsulation on the integrated circuit die with the peripheral mounting region exposed from the top encapsulation;
• forming a routing layer, having a conductive land, from the lead-frame;
• and
• forming a bottom encapsulation partially encapsulating the routing layer and the insulation cover.

An integrated circuit packaging system comprising:

• a routing layer having a conductive land, a metal connector, and a peripheral mounting region, the metal connector on the conductive land;
• an insulation cover on the routing layer;
• an integrated circuit die mounted over the insulation cover;
• a top encapsulation encapsulating the integrated circuit die with the peripheral mounting region exposed from the top encapsulation;
• and
• a bottom encapsulation partially encapsulating the routing layer and the insulation cover.