Package on package structures and methods for forming the same

A semiconductor device package comprising:

• a first package comprising:
• a first connector;
• a second connector spaced from the first connector along a first direction;
• a third connector spaced from the first connector along a second direction different from the first direction;
• a molding compound between the first connector and the third connector;
• and
• an opening in the molding compound between the first connector and the second connector;
• a second package bonded to the first package, wherein the second package comprises:
• a bonding element, wherein the bonding element extends into the opening, and the bonding element is bonded to at least the first connector.

A packaged semiconductor device comprising:

• a plurality of first conductive structures on a first package with a first semiconductor die;
• a plurality of second conductive structures on a second package with a second semiconductor die;
• a plurality of bonding structures between the first package and the second package, wherein each bonding structure of the plurality of bonding structures connects a first conductive structure of the plurality of first conductive structures with a corresponding second conductive structure of the plurality of second conductive structure;
• and
• a molding compound having a first curved sidewall adjacent to each first conductive structure of the plurality of first conductive structures.