Bonded System with Coated Copper Conductor
AssigneeInfineon Technologies AG
InventorReinhold Bayerer
Life of this patent
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Abstract
A semiconductor component includes a semiconductor die and a copper-containing electrical conductor. The semiconductor die has a semiconductor device region, an aluminum-containing metal layer on the semiconductor device region, and at least one additional metal layer on the aluminum-containing metal layer which is harder than the aluminum-containing metal layer. The copper-containing electrical conductor is bonded to the at least one additional metal layer of the semiconductor die via an electrically conductive coating of the copper-containing electrical conductor which is softer than the copper of the copper-containing electrical conductor.
Claims22
A semiconductor component, comprising:
- a semiconductor die having a semiconductor device region, an aluminum-containing metal layer on the semiconductor device region, and at least one additional metal layer on the aluminum-containing metal layer which is harder than the aluminum-containing metal layer;
- and
- a copper-containing electrical conductor bonded to the at least one additional metal layer of the semiconductor die via an electrically conductive coating of the copper-containing electrical conductor which is softer than the copper of the copper-containing electrical conductor.
A method of manufacturing a semiconductor component, the method comprising:
- providing a semiconductor die having a semiconductor device region, an aluminum-containing metal layer on the semiconductor device region, and at least one additional metal layer on the aluminum-containing metal layer which is harder than the aluminum-containing metal layer;
- and
- ultrasonically bonding a copper-containing electrical conductor to the at least one additional metal layer of the semiconductor die via an electrically conductive coating of the copper-containing electrical conductor which is softer than the copper of the copper-containing electrical conductor.
A semiconductor component, comprising:
- a semiconductor die having a semiconductor device region, an aluminum-containing metal layer on the semiconductor device region, and at least one additional metal layer on the aluminum-containing metal layer;
- a copper-containing electrical conductor bonded to the at least one additional metal layer of the semiconductor die via an electrically conductive coating of the copper-containing electrical conductor which is softer than the copper of the copper-containing electrical conductor;
- and
- wherein the at least one additional metal layer of the semiconductor die is hard enough to prevent significant deformation of the aluminum-containing metal layer of the semiconductor die when the copper-containing electrical conductor is bonded to the at least one additional metal layer of the semiconductor die.
Dependencies are inferred from the claim text.