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US 2014/0197537 A1Published application
Void-Free Metallic Filled High Aspect Ratio Openings
OwnerUri Coheninventor
Life of this patent
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Abstract
One embodiment is a device which includes at least one filled via or trench wherein the at least one filled via or trench includes void-free filled metal or alloy, and the filled via or trench has an aspect ratio in a range from 9:1 to about 28:1.
Claims32
A device comprising at least one filled via or trench wherein:
- the at least one filled via or trench comprises void-free filled metal or metal alloy;
- and
- the filled via or trench has an aspect ratio in a range from 9:1 to about 28:1.
Dependencies are inferred from the claim text.